Speaker(s): Eli Cox Agenda: 6:25to 6:35 PM - Open for participants to enter and network. 6:35 to 6:40 PM - IEEE LM and CTCN Business meeting and to introduce speaker. 6:40 to 7:55PM - Formal Program and Q&A. Room: 8, Bldg: Asian American Resource Center, 8401 Cameron Rd., Austin, Texas, United States, 78754, Virtual: https://events.vtools.ieee.org/m/477911

Speaker(s): Eli CoxAgenda: 6:25to 6:35 PM - Open for participants to enter and <a href="http://network.6:35" target="_blank" title="network.6:35">network.6:35 to 6:40 PM - IEEE LM and CTCN Business meeting and to introduce <a href="http://speaker.6:40" target="_blank" title="speaker.6:40">speaker.6:40 to 7:55PM - Formal Program and Q&A.Room: 8, Bldg: Asian American Resource Center, 8401 Cameron Rd., Austin, Texas, United States, 78754, Virtual: https://events.vtools.ieee.org/m/477911

Come join us for this Dine and Learn event hosted by the Denver Section and University of Colorado Boulder. You're invited to participate in an exciting and engaging presentation titled "From Wafers to Cutting-Edge Products: The process of Testing, Packaging, and Design" by Tim Swettlen. Whether you're a college student eager to expand your knowledge or a technical professional looking to stay informed in this evolving industry, this presentation aims to cover the key test and assembly stages that deliver functional products to market. * Food and beverage will be provided. * Parking code will be provided to event registrants. Abstract: As Moore’s Law slows down on transistor density at the die level, advanced packaging methods are bridging the gap and continue to deliver ever more powerful products. To understand these changes, a thorough understanding of the testing flow is important as more die are stacked on a single final product. This talk starts as the wafer exits the fab, is exposed to a battery of tests and routed to its highest value package and product. Each die on the wafer is processed on the same test flow but its testing results will direct it to different bins sold at different selling prices. These complex test flows allow the right parts to be assembled into the best final product whether it’s an advanced smart phone or an entry level AI accelerator card. Co-sponsored by: University of Colorado Boulder Speaker(s): Tim Swettlen, Agenda: Agenda: 6:00- 6:30PM Food and networking 6:30-7:30 PM Presentation 7:30- 8:00 PM Q&A Discussion 8:00 PM Adjourn Room: 1B70, Bldg: Discovery Learning Center (DLC), University of Colorado Boulder, 1095 Regent Drive, Boulder, Colorado, United States, 80309, Virtual: https://events.vtools.ieee.org/m/476572

Come join us for this Dine and Learn event hosted by the Denver Section and University of Colorado Boulder. You're invited to participate in an exciting and engaging presentation titled "From Wafers to Cutting-Edge Products: The process of Testing, Packaging, and Design" by Tim <a href="http://Swettlen.Whether" target="_blank" title="Swettlen.Whether">Swettlen.Whether you're a college student eager to expand your knowledge or a technical professional looking to stay informed in this evolving industry, this presentation aims to cover the key test and assembly stages that deliver functional products to <a href="http://market.*" target="_blank" title="market.*">market.* Food and beverage will be <a href="http://provided.*" target="_blank" title="provided.*">provided.* Parking code will be provided to event <a href="http://registrants.Abstract:As" target="_blank" title="registrants.Abstract:As">registrants.Abstract:As Moore’s Law slows down on transistor density at the die level, advanced packaging methods are bridging the gap and continue to deliver ever more powerful products. To understand these changes, a thorough understanding of the testing flow is important as more die are stacked on a single final <a href="http://product.This" target="_blank" title="product.This">product.This talk starts as the wafer exits the fab, is exposed to a battery of tests and routed to its highest value package and product. Each die on the wafer is processed on the same test flow but its testing results will direct it to different bins sold at different selling prices. These complex test flows allow the right parts to be assembled into the best final product whether it’s an advanced smart phone or an entry level AI accelerator <a href="http://card.Co-sponsored" target="_blank" title="card.Co-sponsored">card.Co-sponsored by: University of Colorado BoulderSpeaker(s): Tim Swettlen, Agenda: Agenda:6:00- 6:30PM Food and networking6:30-7:30 PMPresentation7:30- 8:00 PM Q&A Discussion8:00 PM AdjournRoom: 1B70, Bldg: Discovery Learning Center (DLC), University of Colorado Boulder, 1111 Engineering Drive, Boulder, Colorado, United States, 80309, Virtual: https://events.vtools.ieee.org/m/476572

Join the IEEE PES/IAS Denver Chapter during our April technical meeting. Our guest speaker this month is Vince Fugetta, Energy Policy Advisor for the City and County of Denver. This is a co-hosted meeting with the IEEE Denver Young Professionals Chapter. Note that this event is at the Original Brooklyn's at 2644 W Colfax Ave, Denver, CO 80204.Schedule6:00 – Check-in, Chapter Business and Networking6:30 – Dinner Served7:00 – Presentation8:00 – AdjournTitle: Modernizing Denver's Electric Grid for a Zero-Carbon FutureSummary:The City of Denver is embarking on initiatives to help modernize its electric grid to prepare for the increased demands of a zero-carbon future. Modernizing the electric grid will require investments that support building electrification, which includes increasing distribution system capacity to account for heat pump heating and cooling and EV charging. Denver's Office of Climate Action, Sustainability, and Resiliency (CASR) is actively working with Xcel Energy and the Public Utilities Commission to update Denver's electric grid to enable the city to meet its zero emission goals. Vince Fuggetta from CASR will provide an overview of programs, policies, and projects designed to guide our city through the clean energy <a href="http://transition.Speaker(s):" target="_blank" title="transition.Speaker(s):">transition.Speaker(s): VinceBldg: Original Brooklyns, 2644 W Colfax Ave, Denver, Colorado, United States, 80204, Virtual: https://events.vtools.ieee.org/m/478537

Join the IEEE PES/IAS Denver Chapter during our April technical meeting. Our guest speaker this month is Vince Fugetta, Energy Policy Advisor for the City and County of Denver. This is a co-hosted meeting with the IEEE Denver Young Professionals Chapter. Note that this event is at the Original Brooklyn's at 2644 W Colfax Ave, Denver, CO 80204. Schedule 6:00 – Check-in, Chapter Business and Networking 6:30 – Dinner Served 7:00 – Presentation 8:00 – Adjourn Title: Modernizing Denver's Electric Grid for a Zero-Carbon Future Summary: The City of Denver is embarking on initiatives to help modernize its electric grid to prepare for the increased demands of a zero-carbon future. Modernizing the electric grid will require investments that support building electrification, which includes increasing distribution system capacity to account for heat pump heating and cooling and EV charging. Denver's Office of Climate Action, Sustainability, and Resiliency (CASR) is actively working with Xcel Energy and the Public Utilities Commission to update Denver's electric grid to enable the city to meet its zero emission goals. Vince Fuggetta from CASR will provide an overview of programs, policies, and projects designed to guide our city through the clean energy transition. Speaker(s): Vince Bldg: Original Brooklyns, 2644 W Colfax Ave, Denver, Colorado, United States, 80204, Virtual: https://events.vtools.ieee.org/m/478537