Title: Interconnection Scaling – Going Big and Going Small Abstract: This presentation will cover a high-level overview of interconnections between integrated circuits – trends over the past several decades and what technologies may support future trends, along with a discussion of basic signal integrity considerations for such interconnections. Over most of the past 50 years the scaling of silicon integration was the winning hand for increased performance with packaging and interconnections scaling at substantial lower rates. Fundamental challenges in nanometer process nodes have effectively ended the steadily increasing benefits of Moore’s Law so new paradigms for 2D, 2.5D, and 3D Heterogeneous Integration packaging technologies are being proposed and developed to keep system performance scaling moving forward. Rapidly moving a lot of data between chips is fundamental to all these approaches. One approach for dense, high bandwidth interconnections will be discussed in some detail to illustrate tradeoffs and discuss the limits of how interconnections between chips can reach the limits of interconnections within chips. Co-sponsored by: University of Colorado Boulder Agenda: 6:30PM - 7:00PM Social 7:00PM - 8:00PM Technical Talk Room: KOBL 352, Bldg: Rustandy Building, 1111 Engineering Dr, Boulder, Colorado, United States, 80309

Title: Interconnection Scaling – Going Big and Going SmallAbstract: This presentation will cover a high-level overview of interconnections between integrated circuits – trends over the past several decades and what technologies may support future trends, along with a discussion of basic signal integrity considerations for such interconnections. Over most of the past 50 years the scaling of silicon integration was the winning hand for increased performance with packaging and interconnections scaling at substantial lower rates. Fundamental challenges in nanometer process nodes have effectively ended the steadily increasing benefits of Moore’s Law so new paradigms for 2D, 2.5D, and 3D Heterogeneous Integration packaging technologies are being proposed and developed to keep system performance scaling moving forward. Rapidly moving a lot of data between chips is fundamental to all these approaches. One approach for dense, high bandwidth interconnections will be discussed in some detail to illustrate tradeoffs and discuss the limits of how interconnections between chips can reach the limits of interconnections within <a href="http://chips.Co-sponsored" target="_blank" title="chips.Co-sponsored">chips.Co-sponsored by: University of Colorado BoulderAgenda: 6:30PM - 7:00PM Social7:00PM - 8:00PM Technical TalkRoom: KOBL 352, Bldg: Rustandy Building, 1111 Engineering Dr, Boulder, Colorado, United States, 80309

IEEE Denver Computer, Information Theory & Robotics Society, Computational Intelligence Society, and Colorado School of Mines – Joint Technical Meeting (triple event).February 14, 2024, 4:00 PM – 5:00 PM (MDT)Thong Quoc (Bill) HuynhPresentation: Reduced Dimensionality of State Space: Faster Motion Planning and Infeasibility <a href="http://Proofs.Jonathan" target="_blank" title="Proofs.Jonathan">Proofs.Jonathan DillerPresentation: Path-Finding for Energy-Sharing Drone-UGV <a href="http://Teams.Dr" target="_blank" title="Teams.Dr">Teams.Dr. Frankie ZhuPresentation: Autonomous Robots Traversing Space <a href="http://Environments.Location:" target="_blank" title="Environments.Location:">Environments.Location: Colorado School of Mines Marquez Hall, room 126Parking: Free street parking along Washington Ave and parts of 16th, 17th, and Arapahoe streets (look for City of Golden signs, parking on campus streets requires a permit). Paid parking is available at 940 18th St, Golden, CO 80401.Invited: Colorado School of Mines and IEEE CIR & CIS society <a href="http://members.Cost:" target="_blank" title="members.Cost:">members.Cost: FreeSpeaker(s): , , Room: 126, Bldg: Marquez Hall, 1600 Arapahoe St, Golden, CO 80401, Colorado, United States, 80401

IEEE Denver Computer, Information Theory & Robotics Society, Computational Intelligence Society, and Colorado School of Mines – Joint Technical Meeting (triple event). February 14, 2024, 4:00 PM – 5:00 PM (MDT) Thong Quoc (Bill) Huynh Presentation: Reduced Dimensionality of State Space: Faster Motion Planning and Infeasibility Proofs. Jonathan Diller Presentation: Path-Finding for Energy-Sharing Drone-UGV Teams. Dr. Frankie Zhu Presentation: Autonomous Robots Traversing Space Environments. Location: Colorado School of Mines Marquez Hall, room 126 Parking: Free street parking along Washington Ave and parts of 16th, 17th, and Arapahoe streets (look for City of Golden signs, parking on campus streets requires a permit). Paid parking is available at 940 18th St, Golden, CO 80401. Invited: Colorado School of Mines and IEEE CIR & CIS society members. Cost: Free Speaker(s): , , Room: 126, Bldg: Marquez Hall, 1600 Arapahoe St, Golden, CO 80401, Colorado, United States, 80401

Abstract: This presentation explores the essential skills and knowledge needed by control system engineers in the space launch industry, focusing on the gap between academic theory and practical industry applications. While graduates learn key concepts like linear and nonlinear systems, root-locus methods, and Matlab-based analysis, professionals in the field must go further by mastering Nichols plots, designing control schemes for multiple-input systems, and performing complex analyses in languages like Fortran. This talk aims to prepare future engineers by highlighting these advanced skills, ensuring they are well-equipped to contribute to the evolving demands of the space launch sector. Attendees will learn how to apply their academic foundations to real-world challenges and innovate within the industry. Speaker(s): Mr. William Burgoyne, Room: W375, Bldg: Brown Hall, 1523 Illinois St, Golden, Colorado, United States, 80401

Abstract: This presentation explores the essential skills and knowledge needed by control system engineers in the space launch industry, focusing on the gap between academic theory and practical industry applications. While graduates learn key concepts like linear and nonlinear systems, root-locus methods, and Matlab-based analysis, professionals in the field must go further by mastering Nichols plots, designing control schemes for multiple-input systems, and performing complex analyses in languages like Fortran. This talk aims to prepare future engineers by highlighting these advanced skills, ensuring they are well-equipped to contribute to the evolving demands of the space launch sector. Attendees will learn how to apply their academic foundations to real-world challenges and innovate within the <a href="http://industry.Speaker(s):" target="_blank" title="industry.Speaker(s):">industry.Speaker(s): Mr. William Burgoyne, Room: W375, Bldg: Brown Hall, 1523 Illinois St, Golden, Colorado, United States, 80401

Meeting for general administration and operation of the Black Hills <a href="http://Subsection.Virtual:" target="_blank" title="Subsection.Virtual:">Subsection.Virtual: https://events.vtools.ieee.org/m/464034