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Speaker: Dr. Michael Roberg, Engineering Fellow, Qorvo
Topic: Power Without Pain: High Power MMIC PA Design, the Pitfalls and how to Avoid Them
Abstract:
This presentation discusses high-power monolithic microwave integrated circuit (MMIC) power amplifier (PA) design in Gallium Arsenide (GaAs) and Gallium Nitride (GaN). It compares GaN and GaAs technologies from a power- amplifier design perspective, highlighting their relative advantages and limitations. The presentation then introduces widely used MMIC PA topologies for microwave applications, including reactively matched, non-uniform distributed, balanced, push-pull, Doherty, and serially combined architectures. Common design pitfalls are examined in detail, along with practical strategies to avoid them and improve first-pass design success. Drawing on over 20 years of experience across defense, commercial, and academic sectors, the presentation offers valuable insights for MMIC designers and non- designers alike.
Bio:
Michael Roberg received the Ph.D. degree from the University of Colorado at Boulder in 2012. From 2003 to 2009, he was an engineer at Lockheed Martin-MS2 in Moorestown, NJ working on advanced phased array radar systems. From 2012 to 2022 he worked for Qorvo in the High Performance Analog business unit as a MMIC Design Engineering Fellow. In 2021, he received the Outstanding Young Engineer award from MTT-S and in 2022 he won the industry paper competition at IMS in Denver. From 2022-2024 he was an Engineering Fellow at mmTron, Inc. where he focused on MMIC development for millimeter wave systems. Michael re-joined Qorvo as an engineering fellow in the research organization in 2024 and continues to focus on advanced MMIC development.
Date & Time: February 18, 2026, 11:00am-12:30pm CST
Cost: Free
Event Co-Sponsored by UTD IEEE AP-S/MTTS-Student Chapters and MTT-S Dallas
Room: ECSS 2.201, The University of Texas at Dallas,, 800 W Campbell Rd, Richardson, Texas, United States, 75080, Virtual: https://events.vtools.ieee.org/m/537032