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What Makes Green RF Electronics: Advanced Materials, Packaging, and Emerging Applications
April 17 @ 1:00 pm - 2:30 pm CDT
The electronics industry produces non-negligible emissions and e-waste, and is a major consumer of critical raw materials (CRMs), which could hinder its growth to deliver our digital aspirations. I will introduce a life cycle assessment (LCA)-driven approach to electronics design, showing how to quantify the true environmental footprint as well as methods to design electronics for environmental sustainability and supply chain resilience. Looking at the impact of semiconductor devices and specifically RFICs, methods for circularity through recycling and re-use will be introduced, identifying trade-offs in reliability, performance, and ease of recycling. Fully biodegradable RF package assemblies with high-performance transmission beyond 120 GHz will be showcased, along with their ability to enable a circular economy for RFICs, without the use of traditional bonding approaches. Finally, emerging applications in RF-based sensing will be introduced, showing how microwave electronics could reduce the complexity of sensing interfaces.
Speaker(s): Mahmoud
Room: 1.365, Bldg: ECSW, 800 W Campbell Rd, Richardson, Texas, United States, 75080