Overview Title: Tech Insider Webinar: A Fully Automatic Test System for Characterizing Wide-I/O Micro-Bump Probe Cards Date: Thursday, July 06, 2017 Time: 12:00 PM Eastern Daylight Time Duration: 1 hour In the context of pre-, mid-, and post-bond testing of dies in a 2.5D- and 3D-stacked IC, a fully automatic test system for characterizing advanced... Read more →