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2-Hour Short Course: Reliability Physics and Failure Mechanisms in Electronics Packaging 2-Hour Short Course: Reliability Physics and Failure Mechanisms in Electronics Packaging Speaker: Xuejun Fan, Regents’ Professor, Department of Mechanical Engineering, Lamar University Meeting Date: Wednesday, November 2, 2022 Time: Checkin via WebEx at 7:45 AM; Presentation 8:00 - 10:00 AM (PDT) Cost: none Reservations: eps2211a.eventbrite.com Summary: This course presents an overview of the physics of failures in electronics packaging. The course discusses key fundamental concepts of reliability physics associated with various stress conditions, including thermal degradation, thermo-mechanical stress, dynamic and vibrational loading, moisture and humidity, as well as electrical current stress. Failure mechanisms studied include chip-package interactions, micro-bump reliability, electromigration performance, inter-layer dielectric (ILD) damage under bumps and Cu pillars, solder joint reliability, drop and vibrational damage, interfacial delamination, and the impact of moisture and environmental humidity. Acceleration factor models for different failure mechanisms are introduced. Stress analysis methods using finite element analysis (FEA) with specific applications to packaging are described. Course Outline: Introduction to advanced package reliability physics Thermal and thermo-mechanical driven failure mechanisms Dynamic and vibrational-driven damages Moisture and humidity-induced failures Electromigration Summary For further presentations on reliability for electronics and photonics packaging, please attend REPP, November 9-10, 2022. Bio: Xuejun Fan   is a Regents’ Professor of the Texas State University System, the Mary Ann and Lawrence E. Faust endowed chair professor in the Department of Mechanical Engineering at Lamar University, Beaumont, Texas. He received his Ph.D. degree in solid mechanics from Tsinghua University, Beijing, China in 1989. His interests and research lie in the area of modeling, characterization, and reliability in heterogeneous integration in microelectronics. Dr. Fan had extensive experience in the semiconductor packaging industry, such as with Intel Cooperation, Philips Research, and the Institute of Microelectronics (IME), Singapore. Dr. Fan received the Outstanding Sustained Technical Contribution Award in 2017, and the Exceptional Technical Achievement Award in 2011 from IEEE Electronics Packaging Society (EPS). He is an Associate Editor of IEEE Transactions on Components, Packaging and Manufacturing Technology and Microelectronics Reliability. Dr. Fan is an IEEE Fellow and a Distinguished Lecturer. He serves as chair, co-chairs, and committee members of various conferences such as ECTC, EPTC, ESTC, EuroSimE, ICEPT, ESREF, and EMPT. He has published more than 300 papers, including 4 books, over 100 journal papers, many book chapters, and numerous conference papers. Dr. Fan currently serves as a member-at-large of the IEEE Electronic Packaging Society (EPS) Board of Governors, and a co-chair of Modeling and Simulation in Heterogeneous Integration Roadmap (HIR). Title: Reliability Physics and Failure Mechanisms in Electronics Packaging Excerpt: -- stress conditions, thermo-mechanical, vibrational, moisture, humidity, electromigration, acceleration factors, applications ...
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Packaging of Bioelectronic Implants: Key Building Blocks and Recent Advances -- sensors, electrodes, wireless power, data telemetry, integration, neurostimulation, embedded, heterogeneous integration ...
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(on the Internet)
Semiconductor Packaging: The Future Is Now -- emerging applications, on-shoring, US univ programs in semiconductor packaging, curriculum development, workforce ...
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(on the Internet)
Growth in Semiconductor Packaging and Assembly: Are We in Another “Roaring 20s”? -- continued expansion, drivers, shortages, application areas ...
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(On the Internet)
Chiplet-in-Wafer Technology for the Development of III-V RF ICs -- 5G, radar, compound semiconductors, co-integration, packaging solutions, in passive wafer interconnects ...
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(On the Internet)
Heterogeneous 3D Nanoscale Components and Integration for Power, RF and Bioelectronic Functions The IEEE EPS (Electronics Packaging Society) Dallas Chapter is sponsoring a technical presentation on Heterogeneous 3D Nanoscale Components and Integration for Power, RF and Bioelectronic Functions.  The presenter is Professor Markondeyaraj (Raj) Pulugurtha.  Details on the presentation are below (abstract and bio).  Webex details below as well. Heterogeneous 3D Nanoscale Components and Integration for Power, RF and Bioelectronic Functions Abstract: Heterogeneous component integration with seamless and 3D connectivity between digital, RF, analog and passive components in a single package with high bandwidth at lower power is the key to realize future electronic and bioelectronic systems. This talk describes the recent nanomaterial and nanoscale component integration breakthroughs that are making heterogeneous integration a reality. Nanomagnetic inductors, high surface area nanocapacitors and innovative 3D component designs will be described for integrated power delivery. The second part focuses on material and component integration technologies for high-bandwidth 5G communications. include high-gain antenna arrays in a package with integrated power dividers and combiners, integrated electromagnetic interference isolation structures between power amplifier (PA) and low-noise amplifier (LNA) interconnects and integrated nanomagnetic and nanodielectrics for nonreciprocal and tunable components. The last part of the presentation describes nanopackaging technologies to enable bioelectronic systems with seamless integration between neural recording arrays, active devices and wireless interfaces for ultra-miniaturized wearable and implantable bioelectronic systems. Specific advances in system-in-flex packages for wearable electronics, miniaturized power telemetry and low-impedance electrodes will be discussed. Biography: Dr. P. M. Raj‘s expertise is in packaging of electronic and bioelectronic systems, with emphasis on nanoscale RF, power and bioelectronic components, and  active and passive integration in ultrathin embedded modules. He is an Associate Professor in Biomedical Engineering and Electrical and Computer Engineering at Florida International University. He demonstrated several electronic packaging technologies, working with the whole electronic ecosystem, which include several  semiconductor, packaging and material, tool, and end-user companies. He co-led the development of world’s first 3D glass LTE diversity module, and 3D glass antenna-integrated package module for 5G mm wave applications. He developed advanced substrate-integrated power inductors and power capacitors for integrated power modules and voltage regulators.  He is widely recognized for his contributions in integrated passive components and technology roadmapping, component integration for bioelectronic, power and RF modules, and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications through IEEE NTC and EPS. His research led to 340 publications, which include 8 patents. He received more than 30 best-paper awards. He is the Chair of Nanopackaging Technical Committee, EPS Representative of IEEE Nanotechnology Council, IEEE Distinguished Lecturer in Nanotechnology for 2020 and 2021, Associate Editor for IEEE Nanotechnology Magazine and Transactions of Components, Packaging and Manufacturing Technologies (TCPMT). He earned his BTech from IIT Kanpur (1993), ME from IISc, Bangalore (1995) and PhD from Rutgers University (1999).
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