IEEE Central Texas Section

A distinguished panel will deliver a special session on Future Networks towards 6G at "BIG 5G Event" that will take place in Austin Convention Center May 15-17. The session is scheduled for May 17, 11:00 am - 1:00 pm CST, At Partner Stage The session will be delivered by a distinguished panel of: - Ashutosh Dutta- Chief 5G Strategist JHU/APL, Chair, IEEE Future Networks Technical Community - Timothy Lee- Technical Fellow, Boeing - Eman Hammad- Professor, Texas A&M University - Narendra Mangra- Co-Chair, IEEE INGR - Fawzi Behmann- President, Telnet Management Consulting - Rose Hu- Associate Dean for Research and Professor, Utah State University - Tracy Van Brakle- Principal Member of Technical Staff, AT&T Labs Abstract: INGR (International Networks Generation Roadmap) is a key component of IEEE Future Networks Initiative (futurenetworks.ieee.org). The first version of roadmap white paper was published in 2017 that led to the creation of 15 working groups. These working groups include Applications and Services, Artificial Intelligence and Machine Learning, Connecting the Unconnected, Deployment, Edge Services and Automation, Energy Efficiency, Hardware, Massive MIMO, Millimeter Wave and Signal Processing, Optics, Satellite, Standardization and Building Blocks, Systems Optimization, and Testbed. As the industry continues to advance, the evolution and deployment of network generations is influenced and impacted not only by emerging, evolving, and potential convergence of technologies, but also by local and world socio-economic and health conditions (and politics). So much can happen in a year, which is why the INGR is a living document that is updated annually. The inaugural INGR was released in 2020 and its focus was primarily on the evolution of 5G networks. The intention of the 2021 INGR Edition was to take a more end-to-end perspective that included integrating future network technologies and establish a transdisciplinary framework and a predictive model for mobile networks. 2022 and the next two years will be a time of heavy 5G deployment, transformation at the edge, and increased interworking of network technologies and systems. Hence, the 2022 Edition of the IEEE Future Networks International Network Generations Roadmap (INGR) points to trends, challenges, and solutions in the current and near-term mobile network landscape, and the future vision as being cultivated through the activities of Standards Development Organizations (SDOs) and the industry around the globe. This 2022 INGR Edition broadens applications of the transdisciplinary framework, progresses each technology and system challenges and opportunities especially while interworking with other areas — while noting lessons learned that can be applied to beyond 5G. As part of this panel, the working group co-chairs will share the highlights of various INGR technology working groups and how these will affect the evolution of next generation networks and deployments over varying timelines. For questions/clarification, please contact Fawzi Behmann, [email protected] Chair, Austin ComSoc, Signal Processing, and Consumer Technology Joint chapter vTools Ref. https://events.vtools.ieee.org/m/361040 Convension Center, Austin, Texas, United States

“Interconnect Gap” has been a long-standing big challenge caused by the gap between the ever-increasing data rate demand of inter-/intrachip communications and the insufficient capabilities. Existing electrical interconnect (EI) and optical interconnect (OI) face grand barriers to completely address the interconnect issues individually. THz Interconnect (TI), utilizing the frequency spectrum sandwiched between microwave and optical frequencies, holds the high potentials to complement EI and OI by leveraging the advantages of both electronics and optics. In this talk, I will present our research activities in the high potential TI field, including THz silicon waveguide channel development, TI system demonstration, dispersion constrained link bandwidth and mitigation schemes such as Frequency Division Multiplexing (FDM) and Mode Division Multiplexing (MDM). Speaker(s): Jane Gu, Virtual: https://events.vtools.ieee.org/m/359895

The enormous advancement of digital technology and Internet usage has significantly improved our lives but has also threatened our security and privacy. Cyberattacks may have harmful long-term implications for individuals and organizations. High school students are accessible targets for various cybercrimes due to the lack of cybersecurity knowledge and cyber-safe practices. It is important that education about cybersecurity awareness and cyber hygiene practices begin at a young age. Offering cybersecurity knowledge through interactive tutorials and game-based techniques may increase students’ interest in this domain. To develop a security mindset and improve the perception and attitude toward cybersecurity, we created an interactive visualization and practice-based cybersecurity framework for high school students. Through this framework, we attempt to effectively educate students in cybersecurity through animated visualization modules developed in Unity 3D engine, enabling learning of physical, software, and mathematical aspects of cybersecurity. In addition, several other lectures and hands-on activities were developed. Several surveys were conducted to determine whether this framework enhances users' cognitive abilities and improves or develops a security mindset among teenagers. We discuss challenges in such an implementation in a classroom setting, lessons learned, and potential ways of integration into an existing course on computer science or cybersecurity. If time permits, we may also look at another math-oriented high school project that served as a foundation of this project. Co-sponsored by: Dept of Electrical Engineering and Computer Science and CAREERS - Cyber Florida Grant, Florida Atlantic University Speaker(s): Dr. Ahmad Javaid, Room: 405, Bldg: EE96 -- Engineering East, Florida Atlantic University, Boca Raton, Florida, United States, 33431, Virtual: https://events.vtools.ieee.org/m/361568