Title: Advanced Packaging and Integration: Unleashing the Full Potential of Wide-Bandgap Semiconductors.
Abstract:
The projected growth of renewable energy resources, electric transportation systems, high-performance computing and AI are creating high demand for power electronics with improved efficiency, power density, and reliability. Wide-bandgap (WBG) power semiconductors enable power electronics to meet these growing demands due to their faster switching speeds, higher voltage ratings, lower conduction losses, and higher operating temperatures. However, standard packaging technologies result in WBG devices being derated and slowed down. New packaging technologies with low inductance, improved insulation, reduced thermal resistance, and high temperature reliability are essential to unleashing the full potential of WBG devices. Several applications, such as electric vehicles, have begun to implement advanced packaging materials and technologies to boost performance and provide a competitive edge. This presentation will review the challenges associated with packaging WBG power semiconductors, advanced packaging trends in industry, and opportunities offered by advanced packaging technologies and integration strategies.
Co-sponsored by: Rajen Murigan
Speaker(s): , Christina
Virtual: https://events.vtools.ieee.org/m/446232