THE INSTITUTE OF ELECTRICAL AND ELECTRONICS ENGINEERS, INC.
COMMUNICATIONS & VEHICULAR TECHNOLOGY SOCIETIES
2018 TECHNICAL LUNCHEON PROGRAM
Technical Presentation:
Title: “From Embedded Systems to Scalable Platforms: Challenges in the Development of 5G baseband system on chip”
Speaker: Dr. Alan Gatherer, Senior Technical Vice President at Huawei Technologies, USA; and Editor-in-Chief “COMSOC Technical News”
Presentation Download: A_Gatherer_May-2018_Presentation
DATE: Tuesday 15 May 2018
TIME: Registration/networking/luncheon begins at 11:30 a.m.
Presentation is from 12:00-1:00p.m.
PLACE: Café Max
1600 Alma Road. Richardson, TX 75081
Additional parking behind restaurant
COST: Lunch
$10 members
$15 non-members
$5 students & IEEE Life members
Please RSVP to: cheridickey@aol.com
Abstract:
As 5G deployments draw near, many challenges exist for baseband SOCs. Internationally, mobile operators are experiencing subscriber saturation of legacy business model services. Operators plan to offer new Wireless Broadband, Internet of Thing(IOT), and Critical Mission services to continue to grow revenues. And these new services must be delivered at substantially lower cost per bit-per-second($/bps). 5G baseband must address broadband, narrowband, and low latency channels in shared bands and must integrate new sub 6 GHz, new millimeter, and unlicensed bands. The industry is evolving to flexible distributed software, cloud-based Radio Access Nodes and Technologies (RAN/RAT) to address these requirements. Alan’s presentation will show how these new flexible and software defined networks are causing paradigm shifts in how we design and operate baseband SoC.
Bio:
Alan Gatherer is a Senior Technical Vice President at Huawei Technologies, USA and Fellow of the IEEE. He is responsible for R&D efforts in the US to develop next generation baseband chips and software for 4G and 5G basestation modems. His group is developing new technologies for baseband SoC in the areas of dynamic multimode modems, interconnect and memory fabric, CPU/DSP clusters and virtualization, focusing on 5G deployment. Alan joined Huawei in January 2010. Prior to that he was a TI Fellow and CTO at Texas Instruments where he led the development of high performance, multicore DSP at TI and worked on various telecommunication standards. Alan has authored multiple journal and conference papers and is regularly asked to give keynote and plenary talks at communication equipment conferences. In addition, he holds over 70 awarded patents and is author of the book “The Application of Programmable DSPs in Mobile Communications.” Alan holds a bachelor of engineering in microprocessor engineering from Strathclyde University in Scotland. He also attended Stanford University where he received a master’s in electrical engineering in 1989 and his doctorate in electrical engineering in 1993.